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Thermal Specification: The thermal specification shown is the maximum case temperature at the maximum Thermal Design Power (TDP) value for that processor. It is measured at the geometric center on the topside of the processor integrated heat spreader. For processors without integrated heat spreaders such as mobile processors, the thermal specification is referred to as the junction temperature (Tj). The maximum junction temperature is defined by an activation of the processor Intel® Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
